Metal Case for Raspberry Pi 4B (Dual fans)

Metal Case for Raspberry Pi 4B delivers durable mechanical protection combined with enhanced thermal management for compact single-board computing projects. The aluminum alloy enclosure integrates dual active cooling fans and a ventilated cut-out structure that maintains strong wireless performance while improving heat dissipation. This protective computing chassis supports stable operation for embedded development, edge computing nodes, media centers, and continuous-running IoT systems. Precision openings ensure full access to onboard ports while the metal housing improves structural rigidity and long-term durability for demanding maker, laboratory, and industrial prototype environments.

Figure: Aluminum alloy enclosure designed for Raspberry Pi 4B with integrated dual-fan cooling.

Note: two fans in case are not controlled by the program, they will turn on once the Raspberry Pi is powered.

Open Cut‑Out Design Preserving Wireless Connectivity

The ventilated enclosure structure uses a strategic cut‑out layout that avoids shielding wireless signals while maintaining structural strength. Unlike fully sealed metal housings that degrade antenna performance, this open-frame architecture allows stable Wi‑Fi and Bluetooth communication during operation. Precise machining exposes GPIO, HDMI, USB, Ethernet, and power interfaces for unrestricted cable access while supporting convenient integration into robotics platforms, desktop computing setups, or embedded control installations.

Figure: Ventilated cut-out structure maintains wireless signal performance while improving airflow.

Dual-Fan Active Cooling with Aluminum Heat Dissipation

Integrated dual 5V cooling fans significantly enhance airflow across the processor and power circuitry, helping maintain stable operating temperatures during high-load computing tasks. The aluminum alloy housing further improves thermal conduction by spreading heat away from internal components. Combined with included thermal-conductive silicone pads, the cooling system supports demanding workloads such as multimedia processing, edge AI experimentation, continuous data logging, and other compute-intensive embedded applications.

Figure: Dual active cooling fans improve airflow and heat dissipation.

Durable aluminum construction, active airflow cooling, and unobstructed signal transmission make this compact single-board computer enclosure well suited for maker projects, edge computing gateways, home automation hubs, robotics controllers, and STEM Education laboratories where reliable thermal control and physical protection are required for continuous system operation.