Raspberry Pi Dual Cooling Fans Kit (Compatible for Raspberry Pi 3B/3B+/4B)

Raspberry Pi Dual Cooling Fans Kit provides active thermal management for compact single-board computers such as Raspberry Pi 3B, 3B+, and 4B. The cooling solution combines an aluminum heat sink with dual high‑speed fans to improve airflow and reduce processor temperature during demanding workloads. A slotted aluminum structure increases heat dissipation area, while the integrated fans accelerate thermal transfer away from the CPU. Adhesive thermal backing allows quick mounting directly onto the processor surface, enabling a compact and effective cooling upgrade for SBC projects, embedded computing platforms, and continuous‑operation applications.

Figure: Raspberry Pi dual cooling fans kit

Dual-Fan Active Cooling Design

This compact cooling module integrates two 7mm nine‑blade fans mounted directly on an aluminum heat sink. The dual‑fan airflow design accelerates heat exchange across the fin structure, enabling faster temperature reduction compared with passive heat sinks. High rotational speed up to 7500rpm ensures strong airflow across the processor surface, making the thermal solution suitable for heavy computing tasks, continuous server operation, and resource‑intensive applications running on Raspberry Pi development boards.

High-Efficiency Aluminum Heat Sink Structure

The thermal base uses high‑quality aluminum with a slotted surface design that increases effective heat dissipation area. Enhanced surface geometry improves heat conduction from the CPU into the cooling fins, while forced airflow from the integrated fans further accelerates thermal transfer. This efficient heat management structure helps maintain stable processor temperatures and improves reliability for long‑duration computing projects, embedded systems, and edge computing applications.

Simple Adhesive Installation

The cooling assembly includes pre‑applied adhesive backing for quick installation. After cleaning the processor surface, the protective film can be removed and the aluminum heat sink attached directly to the CPU. The installation process requires no additional mounting hardware and maintains a compact footprint suitable for small enclosures or robotics platforms where space efficiency is important.

This SBC cooling accessory supports stable operation in computing projects requiring sustained performance, including media servers, AI edge nodes, robotics controllers, and maker platforms used in STEM Education environments. Reliable thermal control helps maintain processor efficiency while extending the lifespan of compact single-board computer systems.