AL Heat Sink (With adhesive tape) - 28*28*11mm

AL Heat Sink with Adhesive Tape provides a compact thermal management solution for electronic components requiring efficient passive cooling. The aluminum cooling block integrates pre‑applied 3M‑8810 thermal adhesive tape on the mounting surface, enabling fast installation without additional thermal paste or mechanical fixtures. This small aluminum heat dissipation accessory improves heat transfer from integrated circuits, driver chips, and power components by expanding the surface area exposed to airflow. The silvery anodized heatsink structure suits compact electronics, robotics control boards, and embedded development hardware where stable operating temperatures help maintain performance and reliability.

Note: Make sure the surface of the component is clean before sticking the heatsink.

Integrated 3M Thermal Adhesive for Quick Installation

This compact aluminum cooling block includes U.S.-origin 3M‑8810 thermal adhesive tape applied directly to the base. The integrated adhesive layer removes the need for separate thermal glue or mounting clips, simplifying assembly during prototyping or device maintenance. After removing the protective blue film, the thermal pad bonds securely to electronic components, providing strong viscosity and stable attachment. Such design ensures reliable thermal coupling between the heatsink base and heat‑generating chips, improving heat dissipation efficiency.

High Thermal Conductivity Aluminum Construction

Aluminum construction offers a balance between thermal conductivity, lightweight structure, and corrosion resistance. The finned metal body increases surface area for improved airflow exposure, allowing passive heat transfer from electronic components to surrounding air. This small passive cooling accessory suits compact driver boards, motor control circuits, and power management modules where additional airflow may be limited. The sturdy aluminum structure also maintains structural stability across repeated heating and cooling cycles.

Compact Cooling Solution for Embedded Electronics

With a footprint of 28 × 28 mm, the thermal dissipation module fits tightly spaced electronic assemblies without occupying significant board area. The low-profile form factor enables placement on motor driver ICs, voltage regulators, and other heat‑sensitive components in robotics or embedded systems. Such miniature cooling hardware helps extend component lifespan by lowering operating temperatures while maintaining a simple, maintenance‑free passive cooling approach.

Common deployment scenarios include stepper motor driver boards, compact motor controllers, power management circuits, and other heat‑generating semiconductor components. This adhesive aluminum heatsink provides an easy thermal upgrade for robotics electronics, embedded control systems, and DIY hardware prototypes where additional cooling improves operational stability.