Aluminum M.2 2280 Solid-state Drive Heat Sink (Compatible with LattePanda Sigma)

M.2 2280 SSD Heat Sink is a full‑aluminum cooling solution engineered to reduce thermal buildup in high‑performance solid‑state storage devices. The aluminum alloy slot structure significantly expands the cooling surface area, allowing heat to dissipate efficiently and maintain stable operating temperatures during sustained workloads. In typical environments, temperature reduction can reach approximately 10°C to 30°C, helping maintain SSD reliability and performance. This compact passive cooling module integrates a heat pipe and dense fin array to enhance thermal transfer, making the hardware cooler suitable for desktop systems, embedded computing platforms, and compact storage installations that require dependable heat management.

Figure: The structure of the M.2 2280 SSD heat sink

High‑Efficiency Aluminum Heat Dissipation Structure

An aluminum alloy fin array combined with a heat pipe structure greatly increases effective cooling surface area to approximately 4500mm². The passive fin group and electroplated aluminum base work together to conduct and disperse heat away from the SSD controller and memory modules. Electroplating and reflow soldering processes strengthen thermal transfer between structural components, enabling stable passive cooling without requiring fans. This architecture helps prevent overheating during continuous read/write operations while maintaining silent operation.

Figure: M.2 2280 SSD heat sink with four height‑adjustable screws

Adjustable Double‑Sided Clamp Mounting

A dual‑side clamping design combined with four height‑adjustable screws enables compatibility with M.2 2280 SSD modules of varying component heights. This mounting approach provides firm mechanical stability while evenly distributing pressure across the cooling pads. The adjustable hardware simplifies installation and ensures close contact between the cooling structure and the storage module, improving heat transfer efficiency while protecting delicate components during long‑term operation.

Figure: Overview of the M.2 2280 SSD heat sink

High‑Conductivity Thermal Interface Pad

A nano‑silicone thermal pad with conductivity up to 14.8 W/m·K bridges the contact gap between the heatsink and the SSD surface. The soft and flexible interface material adapts to uneven surfaces commonly found on memory chips and controller packages. Low‑viscosity characteristics allow secure thermal contact without damaging or lifting warranty labels on the SSD module, ensuring reliable cooling performance while preserving device integrity.

This passive SSD cooling accessory supports stable temperature control in storage expansion cards, embedded computing platforms, compact PCs, and high‑speed data systems. Reliable heat management helps prevent performance throttling, making the thermal solution suitable for workstation storage arrays, industrial computing equipment, and other environments where sustained SSD performance is required.